Product Information

Product Details
Chemical Composition
Mechanical Property
Product NameCopper Foil 
Material copper
Size Thickness0.006mm~0.105mm as customizedWidth 250mm~1280mm as customized
Samples Free to supply
Purity(Cu+Ag)Greater than or equal 99.9%
AdvantageHigh purity, fine microstructure, very low oxygen content.
No air hole, high porosity, loose, good electrical conductivity,high surface accuracy of the mold
The heat treatment process, the electrode is not directional,is suitable for fine play, fine
Have good thermal properties, processing, ductility, corrosion resistance and weather resistance, etc
 ApplicationMainly used in the manufacturing of printed circuit boards (PCBs) and chip packaging materials, as well as in the lithium battery industry.
 Payment terms   T/T,L/C
Package   Standard export seaworthy package or as required.


GradeChemical Composition(%)

GBJISCu+AgPBiSbAsFeNiPbSnSZnO
Refined CopperT1C102099.950.0010.0010.0020.0020.0050.0020.0030.0020.0050.0050.02
T2C110099.9-0.0010.0020.0020.005-0.005-0.005--
T3C122199.7-0.002----0.01---
Oxygen Free Copper TU0C101199.990.00030.00010.00040.00050.0010.0010.00050.00020.00150.00010.0005
 TU1C102099.970.0020.0010.0020.0020.0040.0020.0030.0020.0040.0030.002
TU299.950.0020.0010.0020.0020.0040.0020.0040.0020.0040.0030.003
Grade (JIS)TemperVickers Hardness (HV)Tensile Strength (Mpa)Elongation (%)
C1100C1201C1220etc.M (Soft)≤70≥195≥30
Y4 (1/4H)60-95215-295≥25
Y2 (1/2H)80-110245-345≥8
Y (Full Hard)90-120295-395≥3
T (Extra Hard)≥110≥350-

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